items	method	Unit	IPC Standard	Typical Value
Peel Strength (90°)	IPC-TM-650 2.4.9D	N/mm	0.53	0.92
surface adhesion(with pure adhesive)	Q/GDSY 6058.26. 2.4.9.3	N/mm	-	0.54
Thermal Stress	IPC-TM-650,No.2.4.13	-	Pass	Pass
Dimensional Stability	IPC-TM-650,No.2.2.4 Method B	%	±0.15	MD:-0.0682 TD:-0.0585
Chemical Resistance	IPC-TM-650,No.2.3.2	%	≥80	＞95
Moisture Absorption	IPC-TM-650,No.2.6.2	%	≤2	0.46
Volume Resistivity	IPC-TM-650,No.2.5.17	MΩ-cm	≥106	2.54×108
Surface Resistance	IPC-TM-650,No.2.5.17	MΩ	≥105	3.68×106
Dielectric Constant	IEC-61189-2-721	-	≤3.8	3.2
Dissipation Factor	IEC-61189-2-721	-	≤0.01	0.0032
MIT	JIS C 6471   R0.38x4.9N	Times	-	＞200
Dielectric Strength	IPC-TM-650,No.2.5.6.1	V/μm	≥100	187

Remarks:

 Explanations: Certified to IPC-4204/25 Copper Clad Adhesiveless,Cast and Cured Polyimide