產(chǎn)品與市場(chǎng)
S1150GH
特點(diǎn)
● 耐CAF能力
● 無(wú)鉛兼容
● 無(wú)鹵、無(wú)銻和無(wú)紅磷
● 較常規中Tg FR-4.1 更低的損耗
應用領(lǐng)域
智能手機,平板電腦,手提電腦,LED, 游戲基站網(wǎng)絡(luò )終端內存,固態(tài)硬盤(pán)等- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
Item0 | Method | Condition | Unit | Typical Value | |
---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 160 | |
Td | IPC-TM-650 2.4.24.6 | TGA (5% wt. loss) | ℃ | 390 | |
T288 |
IPC-TM-650 2.4.24.1 |
TMA | min | >60 | |
T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
Thermal Stress |
IPC-TM-650 2.4.13.1 | 288℃, solder dipping | s | >100 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
IPC-TM-650 2.4.24 |
After Tg | ppm/℃ | 190 | ||
IPC-TM-650 2.4.24 |
50-260℃ | % | 2.2 | ||
Dk |
1GHz |
IPC-TM-650 2.5.5.9 |
C-24/23/50 |
- | 4.05 |
(RC:56%) |
10GHz |
IPC-TM-650 2.5.5.5 |
C-24/23/50 |
- | 3.96 |
Df |
1GHz |
IPC-TM-650 2.5.5.9 |
C-24/23/50 | - | 0.007 |
(RC:56%) |
10GHz |
IPC-TM-650 2.5.5.5 |
C-24/23/50 | - | 0.008 |
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 6.0×108 | |
Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 8.0×107 | |
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 148 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | 45+kV NB | |
Peel Strength (1Oz) | IPC-TM-650 2.4.8 | 288℃/10s |
N/mm[lb/in] |
1.4[8.0] |
|
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
CW | IPC-TM-650 2.4.4 | A | MPa | 430 | |
Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.10 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 |
Remarks:
1. All the typical value is based on the 1.6mm (8*7628) specimen. Dk and Df value is based on 2116 RC56%.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., LTD for detailed information, and all right from this data sheet are reserved by Shengyi Technology Co., Ltd.